PolyU is collaborating with Wenzhou government and hosting the "2026 Hong Kong AI plus Sci and Tech Advancements Competition".
- RMB 3,500 sponsorship for each shortlisted team to pitch at Wenzhou
- More than RMB 35M landing support at Wenzhou
- Incubation support from PolyU if the awarded team selected to land at PolyU InnoHub @ Wenzhou, including but not limited to consultation of local funding application, company registry, finance, legal, investment & industry line-up opportunities.
All undergraduates, postgraduates, post-docs, alumni teams from HSU are welcome!
Application is now open till 5 March 2026 (GMT+8).
Roadshow @ Wenzhou: 27 March 2026
Roadshow venue: 溫州國際雲軟件谷A幢1樓路演中心 (https://j.map.baidu.com/b5/7rm)
Details are available at:
https://www.polyu.edu.hk/kteo/about-kteo/news-and-events/events/2026/03/2026-hong-kong-ai-plus-sci-and-tech-advancements-competition/?sc_lang=en
*此活動非校方舉辦, 同學如有任何查詢可聯絡舉辦機構
*This program/activity is not organised by the University. For any enquiries, students are advised to contact the organiser.